IPC Standard Co. MOQ : 1. Price : 35 usd. Contact Now. Active Member 3 Years. Product Categories.
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IPC Standard Co. MOQ : 1. Price : 35 usd. Contact Now. Active Member 3 Years. Product Categories. Shenzhen Jingxin Electronic Technology Co. Implementing ball grid array BGA and fine-pitch ball grid array FBGA technology presents some unique challenges for design, assembly, inspection and repair personnel. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures.
The major emphasis of Revision C is to provide information on some of the new mechanical failure issues such as cratering or laminate defects caused after assembly. There are many photographs of X-ray and endoscope illustrations to identify some of the conditions that the industry is experiencing in the implementation of BGA assembly processes. Send your message to this supplier.
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Voids in BGAs
Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms. He has over 25 years experience in the electronics assembly industry and is responsible for the global technical service of all of Henkel's solder materials. Contact me at georgiansimion yahoo. Fritz's educational background is in mechanical engineering with an emphasis on materials science. Design of Experiments DoE techniques have been an area of independent study.
IPC-7095C: Design and Assembly Process Implementation for BGAs
IPC-7095C: [PDF FILE ]Design and Assembly Process Implementation for BGAs